24-27 November 2022
Karlsruhe Institute of Technology
Europe/Berlin timezone

Development of Microfabrication processes for a scalable Multilayer Surface Electrode Ion Trap Quantum Computer

26 Nov 2022, 16:00
2h
Foyer (KIT Campus South)

Foyer

KIT Campus South

KIT Campus map: https://www.kit.edu/campusplan/ Building: 30.22 Room: Foyer im 1. und 2. OG Address: Institute of Technology, Engesserstraße 7, 76131 Karlsruhe Coordinates: 49.01244, 8.41062
Poster Physics Posters Poster session

Speaker

Ms. Nila Krishnakumar

Description

Ion traps are promising candidates towards scalable quantum computer. One of the possible designs is the multilayer surface electrode ion traps[1]. The different processes involved in realising it are UV photolithography, Electroplating , Reactive Ion etching and more. Research and development towards the scalable quantum computer is tried with TSVs (through substrate vias) and Flip Chip Bonding for packaging. A solder free thermocompression method is proposed in [2] using gold stud bumps for flipchip bonding , but it brings a risk of damaging the ion trap. An approach with gold micrograss structures in the place of stud bumps is tested for damage free ion trap while bonding.

[1]A. Bautista-Salvador et al. New J. Phys. 21, 043011 (2019), Patent DE 10 2018 111 220 (2019)
[2]M. Usui et al., "Opto-electronic hybrid integrated chip packaging technology for silicon photonic platform using gold-stud bump bonding, (ICEP-IAAC) pp. 660-665 (2015)

Category Particle / Astroparticle / Cosmology (Experiment)

Primary author

Ms. Nila Krishnakumar

Co-authors

Dr. Friederike Julia Giebel Mr. Eike Iseke Mr. Konstantin Thronberens Mr. Jacob Stupp Mr. Amado Bautista-Salvador Prof. Christian Ospelkaus

Presentation Materials

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