24-27 November 2022
Karlsruhe Institute of Technology
Europe/Berlin timezone

Development of Microfabrication processes for a scalable Multilayer Surface Electrode Ion Trap Quantum Computer

26 Nov 2022, 16:00
Foyer (KIT Campus South)


KIT Campus South

KIT Campus map: https://www.kit.edu/campusplan/ Building: 30.22 Room: Foyer im 1. und 2. OG Address: Institute of Technology, Engesserstraße 7, 76131 Karlsruhe Coordinates: 49.01244, 8.41062
Poster Physics Posters Poster session


Ms. Nila Krishnakumar


Ion traps are promising candidates towards scalable quantum computer. One of the possible designs is the multilayer surface electrode ion traps[1]. The different processes involved in realising it are UV photolithography, Electroplating , Reactive Ion etching and more. Research and development towards the scalable quantum computer is tried with TSVs (through substrate vias) and Flip Chip Bonding for packaging. A solder free thermocompression method is proposed in [2] using gold stud bumps for flipchip bonding , but it brings a risk of damaging the ion trap. An approach with gold micrograss structures in the place of stud bumps is tested for damage free ion trap while bonding.

[1]A. Bautista-Salvador et al. New J. Phys. 21, 043011 (2019), Patent DE 10 2018 111 220 (2019)
[2]M. Usui et al., "Opto-electronic hybrid integrated chip packaging technology for silicon photonic platform using gold-stud bump bonding, (ICEP-IAAC) pp. 660-665 (2015)

Category Particle / Astroparticle / Cosmology (Experiment)

Primary author

Ms. Nila Krishnakumar


Dr. Friederike Julia Giebel Mr. Eike Iseke Mr. Konstantin Thronberens Mr. Jacob Stupp Mr. Amado Bautista-Salvador Prof. Christian Ospelkaus

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